Daria bond II

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DARIA Bond II, is a mid-range smartphone manufactured by Multi Ways International L.L.C., a technology firm based in Dubai.

History

The DARIA Bond II was developed for target markets in the UAE and Saudi Arabia. DARIA bond II was officially launched on September 1, 2025, at an event in Dubai, United Arab Emirates.

Specifications

Hardware

Bond II is powered by a MediaTek Dimensity 8350 chipset, which is built on a 4 nm process and features CPU clock speeds of up to 3.35 GHz. For thermal management, the smartphone utilizes a 4,300 mm² vapor chamber cooling system integrated with graphene layers to sustain performance during intensive tasks.Synthetic benchmarks cited by the manufacturer report AnTuTu v10 scores exceeding 1.4 million.

The DARIA Bond II features a 6.67-inch flat AMOLED display with a 1.5K+ resolution and a 120 Hz adaptive refresh rate. The panel supports 10-bit color and has a peak brightness of 2,400 nits for outdoor visibility. The display is covered by Gorilla Glass 5, and the overall build includes an aluminum alloy frame and a layered glass back with a translucent finish and a dotted pattern. The device is rated IP64 for resistance to dust and water splashes.

Hardware features include:

  • Battery: 5,000 mAh capacity.
  • Charging: 66 W wired fast charging and 15 W wireless charging.
  • Audio: Dual 1 W stereo speakers.
  • Haptics: X-axis linear motor for precise vibration feedback.
  • Connectivity: 5G, Wi-Fi 6E, and USB-C 3.2 with DisplayPort 1.2 support for external video output.

Software

The smartphone operates on DariaOS, a new operating system based on Android operating system.

References