MSI EX600 This type of Notebook is quite small and light and also financial attractive compare to his characters.
Motherboard:
CPU Type Mobile DualCore Intel Core 2 Duo T7250, 2133MHz (11 x 194) Motherboard Name MSI MegaBook EX600 Motherboard Chipset Intel Crestline-PM PM965 System Memory (DDR2-667 DDR2 SDRAM) BIOS Type AMI
Front Side Bus Properties:
Bus Type Intel AGTL+ Bus Width 64-bit Real Clock 198 MHz (QDR) Effective Clock 793 MHz Bandwidth 6346 MB/s
Memory Bus Properties:
Bus Type Dual DDR2 SDRAM Bus Width 128-bit DRAM:FSB Ratio 10:6 Real Clock 331 MHz (DDR) Effective Clock 661 MHz Bandwidth 10576 MB/s
Chipset Bus Properties: Bus Type Intel Direct Media Interface
-------------------------------------------------------------------------- North Bridge Properties: North Bridge Intel Crestline-PM PM965 Supported FSB Speeds FSB533, FSB667, FSB800 Supported Memory Types DDR2-533 SDRAM, DDR2-667 SDRAM Maximum Memory Amount 4 GB Revision / Stepping 03 / C0 Package Type 1299 Pin FC-BGA Process Technology 90 nm Core Voltage 1.05 V In-Order Queue Depth 12
Memory Controller: Type Dual Channel (128-bit) Active Mode Dual Channel (128-bit)
Memory Timings: CAS Latency (CL) 5T RAS To CAS Delay (tRCD) 5T RAS Precharge (tRP) 5T RAS Active Time (tRAS) 15T Row Refresh Cycle Time (tRFC) 35T RAS To RAS Delay (tRRD) 3T Read To Precharge Delay (tRTP) 5T Four Activate Window Delay (tFAW) 17T Write CAS Latency (tWCL) 4T Refresh Period (tREF) 7.8 us
Memory Slots: DRAM Slot 1 (DDR2-667 DDR2 SDRAM) DRAM Slot 2 (DDR2-667 DDR2 SDRAM)
CPU Type Mobile DualCore Intel Core 2 Duo T7250, 2133 MHz (11 x 194) CPU Alias Merom-2M CPU Stepping M0 Instruction Set x86, x86-64, MMX, SSE, SSE2, SSE3, SSSE3 Original Clock 2000 MHz Min / Max CPU Multiplier 6x / 11x Engineering Sample No L1 Code Cache 32 KB per core L1 Data Cache 32 KB per core L2 Cache 2 MB (On-Die, ASC, Full-Speed)
Multi CPU:
Motherboard ID MSI_NB Crestline CPU #1 Intel(R) Core(TM)2 Duo CPU T7250 @ 2.00GHz, 1994 MHz CPU #2 Intel(R) Core(TM)2 Duo CPU T7250 @ 2.00GHz, 1995 MHz
CPU Physical Info:
Package Type 479 Ball uFCBGA / 478 Pin uFCPGA Package Size 3.5 cm x 3.5 cm Process Technology 8M, 65 nm, CMOS, Cu, Low-K Inter-Layer, 2nd Gen Strained Si Core Voltage 1.113 - 1.288 V I/O Voltage 1.113 - 1.288 V
CPU Manufacturer: Company Name - Intel Corporation
CPUID:
CPUID Properties: CPUID Manufacturer GenuineIntel CPUID CPU Name Intel(R) Core(TM)2 Duo CPU T7250 @ 2.00GHz Max Temperature 100 °C (212 °F)
Instruction Set supported by: 64-bit x86 Extension (AMD64, Intel64) IA MMX IA SSE IA SSE 2 IA SSE 3 IA Supplemental SSE 3 CLFLUSH Instruction CMPXCHG8B Instruction CMPXCHG16B Instruction Conditional Move Instruction MONITOR / MWAIT Instruction SYSENTER / SYSEXIT Instruction
Security Features supported by: Data Execution Prevention (DEP, NX, EDB)
Power Management Features suppoted by: Automatic Clock Control Digital Thermometer Dynamic FSB Frequency Switching Enhanced Halt State (C1E) Enhanced SpeedStep Technology (EIST, ESS) Processor Duty Cycle Control Thermal Monitor 1 Thermal Monitor 2
Display:
Video Adapter NVIDIA GeForce 8400M G (512 MB) 3D Accelerator nVIDIA GeForce 8400M G Monitor Chi Mei N154I2-L02