STATS ChipPAC Ltd

STATS ChipPAC Ltd. is a service provider of full turnkey semiconductor packaging design, bump, probe, assembly, test and distribution solutions. STATS ChipPAC provides semiconductor packaging and test services to a diversified global customer base servicing the computing, communications and consumer markets. STATS ChipPAC’s customers include some of the largest semiconductor companies in the world.
Headquartered in Singapore, STATS ChipPAC has manufacturing facilities in South Korea, Singapore, China, Malaysia and Taiwan (which includes a 52%-owned subsidiary, STATS ChipPAC Taiwan Semiconductor Corporation, formerly Winstek Corporation).
STATS ChipPAC customer support offices are located in the United States (California’s Silicon Valley, Arizona, Texas and Massachusetts). Offices outside the United States are located in Singapore, South Korea, China, Malaysia, Taiwan, Japan, Switzerland, the United Kingdom and the Netherlands. In addition, STATS ChipPAC has research and development centers in South Korea, Singapore, Malaysia, China, Taiwan and the United States.
STATS ChipPAC is listed on the Singapore Exchange Securities Trading Limited (SGX-ST: STATSChP).
History
ST Assembly Test Services (STATS) was incorporated in Singapore on October 31, 1994 and began test operations in January 1995. STATS originally operated out of a facility and offered wafer sort, assembly, and final test of advanced semiconductors. In October 1996, the company started construction of its . Yishun, Singapore facility and quickly grew to become one of the world’s largest mixed signal test subcontractors supporting the digital and memory sectors within the telecommunications, networking and personal computer markets.
In 2004, STATS merged with ChipPAC to form STATS ChipPAC, the fourth largest assembly and test subcontractor (OSAT) in the world. The company supports many major semiconductor customers with a global manufacturing footprint that spans China, South Korea, Malaysia, Singapore, Thailand and Taiwan, with close proximity to major wafer fabrication hubs.

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